Job title
Principal Engineer, Firmware Engineering H-1B Salaries
94 certified H-1B filings · FY2017–FY2025 · median base $140k.
Median base
$140k
Middle 50%
$127k–$152k
Filings
94
Top sponsor
Western Digital Technologies
Pay distribution
Base salary distribution
Whiskers reach P10–P90; the box is the P25–P75 interquartile range; the heavy line is the median. Base salary only.
By fiscal year
| Fiscal year | Filings | Median base |
|---|---|---|
| FY2025 | 9 | $156k |
| FY2024 | 12 | $141k |
| FY2023 | 11 | $134k |
| FY2022 | 9 | $140k |
| FY2021 | 20 | $145k |
| FY2020 | 4 | $129k |
| FY2019 | 4 | $119k |
| FY2018 | 16 | $126k |
| FY2017 | 9 | $127k |
Top H-1B sponsors of Principal Engineer, Firmware Engineering
Top locations for Principal Engineer, Firmware Engineering
Frequently asked questions
- What is the median H-1B salary for a Principal Engineer, Firmware Engineering?
- The median certified H-1B base salary for Principal Engineer, Firmware Engineering is $140k (FY2025), from 94 filings. The middle 50% earn between $127k and $152k.
- Which companies sponsor the most H-1B Principal Engineer, Firmware Engineerings?
- The top H-1B sponsors for Principal Engineer, Firmware Engineering are Western Digital Technologies, Hgst, Sandisk Technologies.
- Where are most H-1B Principal Engineer, Firmware Engineering jobs located?
- The top worksite locations for H-1B Principal Engineer, Firmware Engineering roles are Irvine, CA, Milpitas, CA, San Jose, CA.
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