Semiconductor Process Engineer H-1B salaries — 82 certified filings (FY2017–FY2026)

26
Filings · FY2025
$106k
Median base · FY2025
$95k–$120k
Middle 50% · FY2025
Micron Technology
Top sponsor · 52 all-time
FY

Semiconductor Process Engineer: 82 certified H-1B LCAs since FY2017. In FY2025 the median base salary was $106k across 26 filings, with the middle 50% of offers between $95k and $120k. The biggest sponsors are Micron Technology, Micron Idaho Semiconductor Manufacturing Triton, N5 Sensors; most filings are in Boise, ID.

How much does a Semiconductor Process Engineer make on an H-1B?

Certified base salary by fiscal year: each box is the p25–p75 range, the heavy line the median, the whiskers reach p10–p90. $106k median in FY2025. Base pay only — hover a year for its figures.

$60k$80k$100k$120k$140k$160k’17’18’19’21’22’23’24’25’26

How has Semiconductor Process Engineer sponsorship changed?

1 certified filings in FY2017 → 22 in FY2026. The change column is each year against the one before.

Semiconductor Process Engineer certified H-1B filings and base salary by fiscal year
Fiscal yearFilingsvs prior FYMedian base
FY202622−15%$110k
FY202526+24%$106k
FY202421+600%$109k
FY20233−25%$115k
FY20224+300%$87k
FY20211−50%$81k
FY201920%$74k
FY20182+100%$75k
FY20171—$85k

Which companies sponsor H-1B Semiconductor Process Engineers?

The employers with the most certified filings, all years, with their median base salary. Open any employer for its full profile.

Top H-1B sponsors for Semiconductor Process Engineer
#EmployerFilingsMedian base
1Micron Technology52$109k
2Micron Idaho Semiconductor Manufacturing Triton23$106k
3N5 Sensors2$74k
4Asrc Federal Space Defense2$75k
5Science Systems and Applications1$89k
6IBM1$167k
7Ostendo Technologies1$85k

Where are H-1B Semiconductor Process Engineer jobs located?

Worksite cities with the most certified filings for this title, all years.

Top worksite cities for H-1B Semiconductor Process Engineer roles
#CityFilingsMedian base
1Boise, ID75$108k
2Rockville, MD2$74k
3Greenbelt, MD2$76k
4Albany, NY1$167k
5Carlsbad, CA1$85k
6Beltsville, MD1$75k

Common questions about Semiconductor Process Engineer H-1B salaries

What is the median H-1B salary for a Semiconductor Process Engineer?
The median certified H-1B base salary for Semiconductor Process Engineer is $106k (FY2025), from 26 filings. Across all years the middle 50% earn between $93k and $120k.
Which companies sponsor the most H-1B Semiconductor Process Engineers?
The top H-1B sponsors for Semiconductor Process Engineer are Micron Technology, Micron Idaho Semiconductor Manufacturing Triton, N5 Sensors.
Where are most H-1B Semiconductor Process Engineer jobs located?
The top worksite locations for H-1B Semiconductor Process Engineer roles are Boise, ID, Rockville, MD, Greenbelt, MD.
Does a certified LCA mean Semiconductor Process Engineer H-1B visas were approved?
No. A Labor Condition Application (LCA) is the Department of Labor attestation an employer must have certified before filing an H-1B petition with USCIS. It records the job, worksite and offered wage, but not whether the petition was filed, selected in the lottery, or approved. Filing counts measure intent to sponsor, not headcount.
What salary do these figures show?
The base annual wage offered on the certified LCA, converted to a yearly amount. Bonus, equity, overtime and benefits are not included, so total compensation is typically higher. Figures are medians and percentiles over certified filings; wages above $5,000,000 a year are excluded as data-entry errors.
What does the fiscal year mean here?
Years are U.S. government fiscal years, October to September: FY2025 runs from October 1, 2024 to September 30, 2025. This matches how the Department of Labor publishes the disclosure files. The most recent year may be partial until its final quarter is released.

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Source: U.S. Department of Labor, Office of Foreign Labor Certification — certified LCA disclosure data through June 2026 (FY2017–FY2026). An LCA is not an approved visa; pay figures are base salary and exclude bonus and equity. Methodology →