GS Microelectronics US — 1 certified H-1B filings (FY2026)
- 1
- Filings · FY2026
- $220k
- Median base · FY2026
- Manager, Advanced Packing
- Top role · 1 all-time
- CA
- Top state · 1 all-time
GS Microelectronics US filed 1 certified H-1B LCAs in FY2026, with a median base salary of $220k and the middle 50% of offers between $220k and $220k. Across all years it has 1 certified filings since FY2026, most often for Manager, Advanced Packing in California.
How much does GS Microelectronics US pay H-1B workers?
Certified base salary by fiscal year: each box is the p25–p75 range, the heavy line the median, the whiskers reach p10–p90. $220k median in FY2026. Base pay only — hover a year for its figures.
How has GS Microelectronics US's H-1B hiring changed by year?
1 certified filings on record (FY2026).
| Fiscal year | Filings | vs prior FY | Median base |
|---|---|---|---|
| FY2026 | 1 | — | $220k |
Which wage levels does GS Microelectronics US file?
DOL prevailing-wage levels I–IV approximate experience tiers (I = entry, IV = fully competent). 100% of GS Microelectronics US's filings sit at Level III–IV. A heavy I–II skew reads as entry-level or contractor-style hiring; a heavy IV skew as senior in-house roles — and higher levels earn more lottery entries.
Share of 1 filings with a wage level · all years
- Level IV100.0%1
What jobs does GS Microelectronics US sponsor for H-1B?
The most-filed job titles across all years (DOL titles, employer pay-grade codes stripped), with base-salary percentiles.
| Job title | Filings | Median base |
|---|---|---|
| Manager, Advanced Packing | 1 | $220k |
Where does GS Microelectronics US hire H-1B workers?
Worksite states on the certified filings, all years. Deeper pink = more filings; hover a state for its figures.
| State | Filings | Median base |
|---|---|---|
| CA | 1 | $220k |
What has GS Microelectronics US filed recently?
Every certified LCA on record for GS Microelectronics US: job title, worksite, prevailing-wage level and the offered base salary.
| FY | Job title | Base salary |
|---|---|---|
| 2026 | Manager, Advanced Packing | $220,000 |
Common questions about GS Microelectronics US's H-1B filings
- How much does GS Microelectronics US pay H-1B workers?
- GS Microelectronics US's median certified H-1B base salary is $220k (FY2026), from 1 filings. See the full salary distribution and percentiles above.
- How many H-1B workers does GS Microelectronics US sponsor?
- GS Microelectronics US has 1 certified H-1B Labor Condition Applications on record (FY2026).
- What jobs does GS Microelectronics US sponsor for H-1B?
- GS Microelectronics US's most-sponsored H-1B roles include Manager, Advanced Packing.
- Where does GS Microelectronics US hire H-1B workers?
- GS Microelectronics US's top H-1B worksite states are CA.
- Does a certified LCA mean an H-1B visa was approved?
- No. A Labor Condition Application (LCA) is the Department of Labor attestation an employer must have certified before filing an H-1B petition with USCIS. It records the job, worksite and offered wage, but not whether the petition was filed, selected in the lottery, or approved. Filing counts measure intent to sponsor, not headcount.
- What salary do these figures show?
- The base annual wage offered on the certified LCA, converted to a yearly amount. Bonus, equity, overtime and benefits are not included, so total compensation is typically higher. Figures are medians and percentiles over certified filings; wages above $5,000,000 a year are excluded as data-entry errors.
- What do prevailing-wage levels I–IV mean?
- The Department of Labor assigns each LCA an OES wage level from I (entry) to IV (fully competent) for the occupation and area. Under the FY2027 wage-weighted H-1B lottery rule, a higher level earns more selection entries, so an employer's level mix is a proxy for how senior its sponsored roles are.
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Source: U.S. Department of Labor, Office of Foreign Labor Certification — certified LCA disclosure data through June 2026 (FY2026). An LCA is not an approved visa; pay figures are base salary and exclude bonus and equity. Methodology →